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PCB MFG Technology Roadmap

Circuit Board Capabilities

 

PCB MFG CAPABILITIES
Layer Count                              
  • 1 – 48+
Largest Panel Size
  • 18″ x 24″
Min. Circuit Width / Spacing
  • .004 mils, 3 mils proto
Material Types
  • FR-4
  • FR406HR
  • PTFE
  • Polyimide
  • Metal Core / Heatsink
Min. Mech. Drilled Hole
  • .003″
Hole & Dim. Tolerances
  • +/- .003″ and +/- .002″
Finishes
  • HASL
  • Lead Free HASL
  • Immersion Silver / Gold/Tin
  • Deep Gold
  • ENIG
  • ENEPIG
  • OSP
New Equipment Upgrade 2015
  • Horizontal Hot Leveler
Electrical Testing
  • Flying Probe
  • Bed of Nails
Fabrication
  • Routing
  • Beveling
  • Scoring
Plasma Processing Unit
  • Teflon Activation
  • Etch Back
  • Desmear
Laser
  • Drilling
  • Routing
  • Trimming
Barcoding and Serialization Both human readable and barcode
MATERIALS

Feature                                        Current CAP Future CAP
Laminate Nominal Tg   260° C  260° C
Laminate Nominal Td   N/A  350° C
Maximum Layer Count   24  24
Min. Finished Thickness   .014″  .014″
Min. Core Thickness   .005″  .004″-.002″
Maximum Panel Size   18″ x 24″   20″ x 24″

FABRICATION

Feature                                       Current CAP Future CAP
Min Finished Hole Size   .006″ .006″
Blind / Buried Vias   .006″ .003″ – .002″
Routed Part Tolerance   .005″ .005″
Scoring Tolerances   .002″ .002″

IMAGING

Feature                                       Current CAP Future CAP
Min Lines /  Spaces   .004″ .003″ – .002″
Min. Quad Flat Pack Pitch   .016″ .016″ – .012″
Min Pad Size   .005″ .005″ – .004″
Soldermask Registration   .003″ .002″
Soldermask Tolerance   .002″ .002″

PLATING & SURFACE FINISHES

Feature  Current CAP Future CAP
Finished Copper Thickness   20 oz   20 oz
Hot Air Solder Leveling   Yes   Yes
Lead-Free Solder (HAL)   Yes   Yes
Full Body Hard Ni / Au   Yes   Yes
Immersion Gold / Silver/Tin   Yes   Yes
OSP   Yes   Yes