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IPC 4101 Lead Free Material Specification Sheet – Pb-free PCBs
4101/99 4101/101 4101/121 4101/124 4101/126 4101/129
Resin System
Primary Epoxy Difunctional Epoxy Difunctional Epoxy Epoxy Epoxy Epoxy
Secondary1 Multifunctional Epoxy Multifunctional Epoxy Multifunctional Epoxy Multifunctional Epoxy Multifunctional Epoxy Multifunctional Epoxy
Secondary2 Modified or Non-epoxy (max 5%) Modified or Non-epoxy (max 5%) Modified or Non-epoxy (max 5%) Modified or Non-epoxy (max 5%) Modified or Non-epoxy (max 5%) Modified or Non-epoxy (max 5%)
Curing Agent Not Specified Not Specified Not Specified Not Specified Not Specified Not Specified
Fillers Contains inorganic
Contains inorganic
N/A N/A Contains Inorganic
N/A
Tg 150 min 110 min 110 min 150 min 170 min 170 min
Td 325 310 min 310 min 325 min 340 min 340 min
Z-Axis CTE
Alpha 1 60 max 60 max 60 max 60 max 60 max 60 max
Alpha 2 300 max 300 max 300 max 300 max 300 max 300 max
50-260 C 3.5 4.0 4.0 3.5 3.0 3.0
T260 (min) 30 min 30 min 30 min 30 min 30 min 30 min
T288 (min) 10 min 5 min 5 min 10 min 15 15
T300 (min) AABUS AABUS AABUS AABUS 2 2

If previous material was standard FR-4: “Material should meet or exceed requirements of IPC 4101/121”. I use 121 instead of 101 because it is open to the use or exclusion of fillers, which are just characteristics of different resin systems. Basically, you want the population of allowable materials to be as large as possible to keep costs down.

If previous material was 170Tg FR4: “Material should meet or exceed requirements of IPC 4101/129 (or /124 if you can go down to 150Tg)”.

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