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SN100CL Minimum Thickness Guidelines
Currently, neither IPC, Nihon Superior, nor Florida Cirtech have set requirements for minimum lead free solder finish requirements. If you've run this solder coating process in the tin-lead version, you know that thickness varies dramatically based on pad size. Furthermore, minimum coating thickness is more critical to the solderability of SN100CL more than it is to standard tin-lead finish. Combining these two facts, it is all the more important to create a new standard by pad area.
After studying literally thousands of panels and the subsequent solderability results, we have now established a coupon and general guidelines for this finish. Please click here for a pdf description of the coupon.
To request a gerber format of this coupon that you can insert into the waste area of your boards, please request it here:
We will also send you our suggested minimum thickness requirements that are the result of our studies.
Having this coupon on the actual board / array removes the variation in acceptability measurements between the supplier and the customer by standardizing not only the location of the measurement, but also the thickness by applicable pad geometry. Should you have any further questions, please do not hesitate to contact us at Saturn Electronics and request to speak with one of our engineers for any technical topics.
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