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Fine Lines & Spacing
Controlled Impedance
Heavy Copper
PTFE / Hybrid
Cavity Boards
Internal Cavities
Thermal Management
Via-in-Pad
Blind / Buried Vias
Multilayer
Edge Plating
Blind / Buried Vias

Definition

Blind Vias start on an outer layer but terminate on an inner layer. Buried Vias exist only between inner layers and do not begin or terminate on an outer layer. Via issues include voids and more.

Applications

Blind and buried vias save real estate as features and lines are designed above or below them without making a connection. Today's fine pitch BGA and flip-chip component footprints do not allow for running traces through. Blind and buried vias connect required layers to the specific area.



18GHz Microwave Cavity (click image for more)
Mouse over pictures below to see description