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Fine Lines & Spacing
Controlled Impedance
Heavy Copper PCB
PTFE / Hybrid
Cavity Boards
Internal-Cavity Boards
Thermal Management
Via-in-Pad
Blind / Buried Vias
Multilayer
Edge Plating / Castellation
Blind / Buried Vias


Definition
Blind Vias
 are defined as those vias that start on an outer layer but terminate on an inner layer. Buried Vias are defined as those vias that exist only between inner layers and do not begin or terminate on an outer layer.

Applications
Blind and buried vias
 help to save PCB real estate by allowing features and lines to be designed above or below them without making a connection. Many of today’s fine pitch BGA and flip-chip component footprints do not allow for running traces and through. Instead, the blind and buried vias will only connect those layers that are required to have a connection in that specific area, allowing for PCB real estate space savings.

Common Issues
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18GHz Microwave Cavity (click image for more)
Mouse over pictures below to see description