Saturn is one of the 50 largest PCB fabricators in North America, and is regularly studying new materials and methods to help save costs. Many suppliers of this technology have developed this specific niche. As a result, their customers must absorb the supplier’s entire overhead via the piece price.
Saturn remains a production PCB supplier with a strong focus on prototyping through production of advanced technologies. However, our facility is also constantly processing higher volumes of standard technology PCBs.
As a result, our overhead is spread over a larger number of production panels and projects, allowing us to charge a fair and reasonable price to our customers that is often not indicative of the high level of technology in the products we produce.
Voids (Desmear / Hole Activation)
To insure that vias are properly desmeared and material hole walls activated, we utilize a two-step desmear process. This process first requires that the panels be processed through a chemical desmear that has been optimized for micro- and blind vias. This line has been outfitted with long-stroke agitation and flight bar vibration to enhance fluid movement and prevent air bubble entrapment. The panels are then submitted to a plasma conditioning process in our March Plasma System. PTFE materials contain Teflon, which has the primary property of not allowing other materials to adhere to it. As such, copper plating is not possible without Plasma Activating the surfaces of the hole wall.
PTFE materials have the property of elongating during processing. This often makes primary and soldermask imaging very difficult. We attack this issue in the following ways: