Edge Plating / Castellations


Edge Plating does not have a set definition per IPC. Merriam-Webster defines Castellated as "having castellated-hole-cavitybattlements like a castle". The industry generally accepts this as being copper plating that continues from the top and bottom surfaces and along one or more perimeter edges.  This semicircle via allows for electric conduction and space creates opening for mounting multiple boards or embedding edge connectors.


Edge Plating and castellations can be used for a variety of purposes, including, but not limited to:

  • Edge Soldering
  • Edge Connections
  • Increase Current Carrying Capacity

Fabrication Issues

Copper Peeling
Plating over a large substrate surface can lead to the plated copper peeling due to a lack of adhesion strength. We address this by first roughening the surface through a combination of chemical and other proprietary means. Next, we employ direct metallization, which has a higher copper bond strength, to prepare the surface for plating.

Often edge plating, especially on castellations, can result in burrs from the final machining process. We apply a modified, proprietary process flow that results in the burrs being polished down to the edge of the feature.


SFS Edge Plating Sample Boards: Click here

About Us

Domestic PCB Fabricator

Bare printed circuit board manufacturer (NAICS: 334412)
Romulus, MI (since 1985)
(734) 941-8100

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