Connects outer layer with inner layer; exposed only on one side of the board.
Connect internal layers without being exposed on either surface.
Chip on Board
Integrated circuits glued and wire-bonded to boards (foregoing packaging) culminating in a Chip with fine wires bonded to both it and landing pads.
Liquid Photoimageable Solder Mask (LPI)
For purpose of controlling deposition, a mask is applied through use of photographic imaging techniques.
Copper layer connected to the ground that covers most of the board layer it inhabits.
Surface adhesive substance spread for bonding or coating, this material (most commonly FR-4) is non-conductive carrier of copper traces.
Also known as Final Finish, it is selected by the customer. The Assembly component process determines plating for the top and bottom layers. The different surface finishing processes are ENEPIG, ENIG, HASL, Pb-free HASL, OSP, Immersion gold, Immersion silver, and Deep Gold. Various factors considered during selection process include application and shelf life.
Copper strip used for carrying signal between two points on a circuit board.
Plated-through hole (PTH) between one or more layers for the purpose of transferring heat from top layer to inner and / or bottom layers connected to internal ground plane.